Workpackage 5: Mass Manufacturing

This information is not restricted to PICCO Partners.

Topics

Objectives
DUV Processing COllaboration
Reports
Manager

Photonic circuits with submicron features, such as the components we propose in WPs 1, 2 and 3, are generally manufactured using e-beam lithography. This process, however, has always proved commercially deficient as a means of mass-production. In order to become the basis for mainstream and low-cost products, photonic microcircuits require a mass-manufacturing fabrication process, so we will assess the possibilities for mass-fabrication of the SOI-based ultra-compact photonic components developed in WP1 and 2.

The main mass-manufacturing technology that will be looked into is Deep UV Lithography. This is to be the mainstream manufacturing technique for CMOS circuits within the next years. The mass-fabrication of optical circuit in Silican can therefor benefit ogf the shear volume of the CMOS market.

Objectives
Establish suitability of photonic crystal waveguides for mass-production by deep UV excimer laser lithography. Address the issues of accuracy (e.g. replication of period and feature size) and reproducibility of structures produced by DUV lithography. Compare structures made via deep UV lithography with structures made by e-beam lithography. Assess viability of mass-manufacturing photonic integrated circuits and address industrial issues.
deep UV Processing Collaboration
As an extension of PICCO WP5, a collaboration is set up that allows third parties to make limited use of IMEC's processing facilities by including their design on one of the PICCO masks. More information on this collaboration can be found here.
Reports
Deliverable 12: Overall evaluation of the potential of 248 and 193nm DUV lithography for SOI-PICs, Fabrication and assessment of PICs using DUV Lithography. (12/9/2003) W. Bogaerts HTML version download Go to WorkPackage 5
Workpackage Manager
Roel BAETS